Instrumentos electrónicos para fabricación

El tiempo y la temperatura son variables muy importantes en la soldadura de circuitos impresos. Es importante llevar los montajes de circuito impreso a una temperatura suficientemente alta durante un período lo suficientemente largo para soldar efectivamente los componentes de la junta. Obtención de la temperatura demasiado alta o calentar el conjunto demasiado rápido puede resultar en daños a los componentes. No calentar las cosas suficientes resultados en los problemas de mala soldadura y fiabilidad.

ECD, fabrica una variedad de instrumentos para ayudarle a controlar el tiempo con precisión y las variables de temperatura en sus procesos de fabricación de la electrónica. Este proceso se llama de perfiles térmicos.

Clásico PCB de perfiles de herramientas se utilizan para crear un proceso repetible térmica que cumpla con las especificaciones requeridas por la pasta de soldadura y / o fabricantes de componentes. Sólo perfiles ¿tiene usted alguna idea de lo que las temperaturas reales de los componentes y la soldadura en un proceso de soldadura por reflujo. De perfiles tiene dos objetivos principales:

1. La determinación de la configuración de proceso correcto (receta horno) necesarios para cumplir con los requisitos de los componentes y la soldadura de una asamblea determinada.
2. Comprobar que la consistencia del proceso para obtener resultados repetibles.

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MEGAM.OLE ® 20
VM.OLE ®
SuperM.OLE ®
Oro
PTP ® VP-8
TOPO ® exploración
( CESE )

TÉRMICA ACCESORIOS PERFILES

Temprobe ™
™ lado del jinete
EZ Rider ™
Reflujo Jinete ™
Los transportistas Board ™
Obstáculos y
Termopares

Verificación

Proceso de repetición "marcó" simplemente por el operador de producción, utilizando la lógica pre-programada del ingeniero ... en herramientas simples y sólidas.

VM.OLE ®
OvenCHECKER ™

Máquina de Gestión de la Calidad

Máquina de Gestión de Calidad perfil de herramientas de la máquina, en lugar de la asamblea o PCB [una vez una receta se ha desarrollado]. Estas herramientas son fáciles de utilizar y proporcionan mediciones para mostrar el resultado de repetición / capacidad de la máquina.

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WaveRider ®
OvenCHECKER ™
OvenRIDER ®
MEGARIDER ™ PTP ®
Fluxometer ™

Planificación y configuración automática

Planificación y configuración automática de herramientas son útiles si usted tiene una nueva asamblea o PCB sin receta existente. Captura la única "firma" de un horno de reflujo. Calcular una primera "receta" para la Máquina, la Asamblea, y la combinación de procesos. Hazlo en un 20-40% del tiempo típico que se necesita para hacerlo bien la primera vez!

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AutoM.OLE ® Xpert3
Perfil de Planificación

Producto de monitorización continua de la calidad

Continuo monitoreo de la calidad del producto herramientas proporcionan al usuario con todos los parámetros del perfil crítica en tiempo real de forma continua de un producto, incluyendo:

• Rampa
• Empapar
• Espiga
• Pico
• Sobre el tiempo
• Número máximo de la pendiente
• Velocidad del transportador

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OvenWATCH ®

RECURSOS

• TOPO ® Consejos
• Consejos técnicos
• N-plomo información y recursos sobre
• Artículos técnicos
• Testimonios de clientes

SMT Newsletter

           

In this week's issue of SMT WEEK, Technical Solutions addresses increasing throughput with solder paste; the predicted end of the PCB; and the anticipated arrival of Steve Wozniak at IPC APEX Expo 2011. Scitech examines an innovative nanoindentation technique; engineered GaN substrates; and chunks of silicon that also contain pathways for light pulses. New products from: GOEPEL, UKI, Laird Tech and more. In the news: a global distribution agreement between Digi-Key and Phihong USA; Sanmina-SCI launches Design Center in Chennai; and SMTA elects new board members. 

     • Technical Solutions
Increasing Throughput with Solder Paste
Mitch Holtzer, Director, Assembly Materials Marketing at Cookson Electronics, explains what customers should look for in a solder paste and how Cookson develops products that can speed up the assembly process.

Doug Brooks: Rumors of PCB's Demise Exaggerated
I'd like to weigh in on Ray Rasmussen's column about the end of the PCB. The problem with predictions like this is that they are based on the wrong metric. True, the number of functions per PCB has been increasing exponentially, almost forever. But I respectfully suggest the correct metric is NOT functions per PCB, but the number of PCBs per box. THAT measure is much more optimistic.

IPC APEX Expo 2011: The Woz is Coming!
Apple Computer Co-Founder Steve Wozniak will deliver the opening keynote address at IPC APEX Expo on Tuesday, April 12, 2011, in Las Vegas. His theme, "How to Foster Creativity and Innovation in a Technical Environment," is a topic the Silicon Valley icon is uniquely equipped to discuss.

Conversation With Mike Silverman: Product Reliability EMS M&A Update With Lincoln's Jack Calderon IPC, NPL Host Soldering and Assembly Defects Webinar

RFID Materials Management in a Unique EMS Environment Continuing to pioneer changes within EMS, NBS has deployed Radio Frequency Identification (RFID) driven intelligent feeder and materials management systems throughout their Santa Clara facility. Sophisticated traceability enables in-process electronic track, monitor, match and recording of components to printed circuit board assemblies. The added value was immediately recognized by medical, aerospace and military market partners. Commercial products providers see new benefits also. Read more...

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cience & Technology

Agilent Announces New Nanoindentation Technique
Agilent Technologies Inc. today announced an innovative nanoindentation technique available exclusively on the Agilent Nano Indenter G200 instrumentation platform. The new technique gives researchers the unprecedented ability to make substrate-independent measurements on thin film materials quickly, easily and confidently by means of nanoindentation.

Soitec, Sumitomo Collaborate on Engineered GaN Substrates
The alliance will draw on Sumitomo Electric's sophisticated GaN wafer manufacturing technology and Soitec's unique Smart Cut layer transfer technology by which ultra-thin GaN layers are transferred from a single GaN wafer to produce multiple, engineered GaN substrates.

Electricity and Light in One Chip
Today's computer chips are chunks of silicon that use electrical pulses to crunch data, but IBM researchers are now making chips for tomorrow: Chunks of silicon that also contain pathways for light pulses.

WSU Professor Studies New Metal QD Vision, LG Display Develop New Gen Active Matrix Displays Graphene Supercapacitor Breaks Storage Record

New Stress-Free & Low Cost ASYS Router ADS 03M Base Depaneling system Cost efficient solution for the medium-size production volume and product mix. Due to its flexibility it is ideal for prototyping, the production of small lots and as back-up for inline production. Click Here to learn more.

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ew Products

GOEPEL electronic Introduces Special Relay Card
GOEPEL electronic introduces a special relay card for integration into fixture adapter systems for In-Circuit Testers. The card is named CION ICT Adapter and was specifically developed to meet customer requirements for Boundary Scan integration into ICT adapter systems.

UKI Launches Breakthrough Anti-Counterfeit Device
UKI CEO, Anthony Dunlop said: "InspectaScan is the first product to provide truly covert product verification at a price point that will engender widespread adoption throughout supply chains in those markets where counterfeit production is most prevalent."

Laird Tech Publishes Thermoelectric Assembly Handbook
The handbook was composed by Laird Technologies' thermoelectric subject matter experts, and focuses on the structure and function of Thermoelectric Assemblies. It provides in-depth insight into understanding heat transfer configurations, primary attributes required for device selection and guidelines for installation and operational use to maximize service life.

ACE Intros Dual Nozzle Selective Soldering Machine Reflowable Thermal Protection Device Launched Techcon Systems Launches New Dispensing Tips

     • SMT Online News
Digi-Key, Phihong USA Sign Global Distribution Agreement
Products from Phihong USA products stocked by Digi-key comprise its standard IEEE802.3af and .at PoE products, including midspans, injectors and splitters, standard wall-mount, desktop and interchangeable-clip adapters and power supplies.

Student Rewarded for Innovation, Enterprise by DEK
Weymouth, UK-based company, DEK, a manufacturer of sophisticated production equipment used in the electronic and solar industries, has named local Bournemouth student, Oliver Dinsey, as the recipient of its annual DEK Prize.

Sanmina-SCI Launches Chennai Design Center
The Sanmina-SCI India Design Center is located in the Madras Special Economic Zone near Chennai. Currently, the Design Center is providing domain expertise in the design and manufacture of medical, networking and communications, optics, defense and aerospace, LED lighting and smart infrastructure technologies.

OSI Systems Secures Electronic Sub-Assemblies Order
OSI Systems, Inc., a vertically-integrated provider of specialized electronic products for critical applications, today announced that OSI Electronics, a business within its Optoelectronic and Manufacturing division, has received an order for approximately $2.5 million for electronic sub-assemblies from a major medical OEM.

SMTA Elects New Board Members
The SMTA is pleased to announce its election results for the Board of Directors for the term that began at SMTA International, October 24-28, 2010.

JJS Electronics Invests in Flying Probe Test Facility Philips to Sell 80% Stake in Assembléon I-Connect007's EMS Asia Week: Outsourcing Picking Up