• Technical Solutions
Increasing Throughput with Solder Paste
Mitch Holtzer, Director, Assembly Materials Marketing at Cookson Electronics, explains what customers should look for in a solder paste and how Cookson develops products that can speed up the assembly process.
Doug Brooks: Rumors of PCB's Demise Exaggerated
I'd like to weigh in on Ray Rasmussen's column about the end of the PCB. The problem with predictions like this is that they are based on the wrong metric. True, the number of functions per PCB has been increasing exponentially, almost forever. But I respectfully suggest the correct metric is NOT functions per PCB, but the number of PCBs per box. THAT measure is much more optimistic.
IPC APEX Expo 2011: The Woz is Coming!
Apple Computer Co-Founder Steve Wozniak will deliver the opening keynote address at IPC APEX Expo on Tuesday, April 12, 2011, in Las Vegas. His theme, "How to Foster Creativity and Innovation in a Technical Environment," is a topic the Silicon Valley icon is uniquely equipped to discuss.
• Science & Technology
Agilent Announces New Nanoindentation Technique
Agilent Technologies Inc. today announced an innovative nanoindentation technique available exclusively on the Agilent Nano Indenter G200 instrumentation platform. The new technique gives researchers the unprecedented ability to make substrate-independent measurements on thin film materials quickly, easily and confidently by means of nanoindentation.
Soitec, Sumitomo Collaborate on Engineered GaN Substrates
The alliance will draw on Sumitomo Electric's sophisticated GaN wafer manufacturing technology and Soitec's unique Smart Cut layer transfer technology by which ultra-thin GaN layers are transferred from a single GaN wafer to produce multiple, engineered GaN substrates.
Electricity and Light in One Chip
Today's computer chips are chunks of silicon that use electrical pulses to crunch data, but IBM researchers are now making chips for tomorrow: Chunks of silicon that also contain pathways for light pulses.
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• New Products
GOEPEL electronic Introduces Special Relay Card
GOEPEL electronic introduces a special relay card for integration into fixture adapter systems for In-Circuit Testers. The card is named CION ICT Adapter and was specifically developed to meet customer requirements for Boundary Scan integration into ICT adapter systems.
UKI Launches Breakthrough Anti-Counterfeit Device
UKI CEO, Anthony Dunlop said: "InspectaScan is the first product to provide truly covert product verification at a price point that will engender widespread adoption throughout supply chains in those markets where counterfeit production is most prevalent."
Laird Tech Publishes Thermoelectric Assembly Handbook
The handbook was composed by Laird Technologies' thermoelectric subject matter experts, and focuses on the structure and function of Thermoelectric Assemblies. It provides in-depth insight into understanding heat transfer configurations, primary attributes required for device selection and guidelines for installation and operational use to maximize service life.
• SMT Online News
Digi-Key, Phihong USA Sign Global Distribution Agreement
Products from Phihong USA products stocked by Digi-key comprise its standard IEEE802.3af and .at PoE products, including midspans, injectors and splitters, standard wall-mount, desktop and interchangeable-clip adapters and power supplies.
Student Rewarded for Innovation, Enterprise by DEK
Weymouth, UK-based company, DEK, a manufacturer of sophisticated production equipment used in the electronic and solar industries, has named local Bournemouth student, Oliver Dinsey, as the recipient of its annual DEK Prize.
Sanmina-SCI Launches Chennai Design Center
The Sanmina-SCI India Design Center is located in the Madras Special Economic Zone near Chennai. Currently, the Design Center is providing domain expertise in the design and manufacture of medical, networking and communications, optics, defense and aerospace, LED lighting and smart infrastructure technologies.
OSI Systems Secures Electronic Sub-Assemblies Order
OSI Systems, Inc., a vertically-integrated provider of specialized electronic products for critical applications, today announced that OSI Electronics, a business within its Optoelectronic and Manufacturing division, has received an order for approximately $2.5 million for electronic sub-assemblies from a major medical OEM.
SMTA Elects New Board Members
The SMTA is pleased to announce its election results for the Board of Directors for the term that began at SMTA International, October 24-28, 2010.
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